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TSOP
Last modified: Wednesday, December 21, 2005 

Short for Thin Small Outline Package, it's a surface-mount memory packaging from Intel. Features of the TSOP include the following: JEDEC and EIAJ standard dimensions, it's the smallest leaded package form factor for flash, 0.5 mm (19.7 mil) lead pitch, reduced total package height, 1.20 mm maximum, gull wing formed leads, and supports future flash density and feature growth. Intel's TSOP package is offered in 32-lead, 40-lead, 48-lead and 56-lead versions in JEDEC and EIAJ registered standard dimensions.

See also Small Outline Package.

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For internet.com pages about TSOP . Also check out the following links!

Related Links

DigChip 
DigChip.com is a leading provider of electronic components documentation. We offer a reliable tool to find semiconductors components technical information: parts, datasheets, cross reference, obsolete and new circuits.

Intel Small Outline Package Guide (PDF) 
The Plastic Small Outline Package (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface-mount memory packaging from Intel. These Small Outline Packages give users strong packaging choices for all types of applications. In addition they support the widest range of nonvolatile memory component densities and features for the user’s applications.

Intel Pentium Processor - Packing Identification Codes
The following is a list of all the different package types that are currently being used on all Intel products. The package types are the prefixes for all of the ordering codes. These order codes are for the commercial components only.

Intersil packaging Information
Includes information on specific types of Plastic, heretic, and Elantec packages.

related categories

Hardware

Integrated Circuits (ICs)

Memory

related terms

90 nanometer

chip

controller

DIMM

DIP

fab

integrated circuit

Intel

JEDEC

PSOP

SOP

SSOP


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