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SSOP
Last modified: Wednesday, December 21, 2005 

Short for Shrink Small Outline Package, it's a surface-mount memory packaging from Intel. Key features of the SSOP include the following: JEDEC standard compliance, direction for Intel’s higher-density flash architectures, 0.8 mm (31.5 mil) lead pitch offers handling characteristics similar to 50 mil pitch packages, performance in wide temperature applications, and a two-sided and gull wing lead package design. Intel's SSOP is JEDEC standard.

See also Small Outline Package.

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For internet.com pages about SSOP . Also check out the following links!

Related Links

DigChip 
DigChip.com is a leading provider of electronic components documentation. We offer a reliable tool to find semiconductors components technical information: parts, datasheets, cross reference, obsolete and new circuits.

Intel Small Outline Package Guide (PDF) 
The Plastic Small Outline Package (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface-mount memory packaging from Intel. These Small Outline Packages give users strong packaging choices for all types of applications. In addition they support the widest range of nonvolatile memory component densities and features for the user’s applications.

Intel Pentium Processor - Packing Identification Codes
The following is a list of all the different package types that are currently being used on all Intel products. The package types are the prefixes for all of the ordering codes. These order codes are for the commercial components only.

Intersil packaging Information
Includes information on specific types of Plastic, heretic, and Elantec packages.

related categories

Hardware

Integrated Circuits (ICs)

Memory

related terms

90 nanometer

chip

controller

fab

integrated circuit

Intel

JEDEC

memory

PSOP

SOP

TSOP


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