Short for Plastic Small Outline Package, it's a surface-mount memory
packaging from Intel. key features of the PSOP include the following:
JEDEC standard compliance,
footprint and height 50 percent of DIP, two-side leaded for routing simplicity, 50 mil
(1.27 mm) pitch for SMT simplicity and ease of use, gull wing formed leads, and
it supports future flash density and feature growth. Intel's PSOP is JEDEC
See also Small Outline Package.
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Intel Small Outline Package Guide (PDF)
The Plastic Small Outline Package (PSOP), Thin Small Outline Package (TSOP), and Shrink Small Outline Package (SSOP) are the surface-mount memory packaging from Intel. These Small Outline Packages give users strong packaging choices for all types of applications. In addition they support the widest range of nonvolatile memory component densities and features for the user’s applications.
Intel Pentium Processor - Packing Identification Codes
The following is a list of all the different package types that are currently being used on all Intel products. The package types are the prefixes for all of the ordering codes. These order codes are for the commercial components only.
Intersil packaging Information
Includes information on specific types of Plastic, heretic, and Elantec packages.